Xinyou Microelectronics

Shenzhen Xinyou Microelectronics specializes in advanced packaging solutions, particularly in Panel-Level Packaging (PLP), serving various high-tech industries with customizable, efficient manufacturing capabilities. Founded in 2019 in Shenzhen, China, Xinyou Microelectronics focuses on developing advanced packaging technologies. The company has pursued a growth strategy that emphasizes integrating localized manufacturing and supply chains to enhance operational efficiency. Recently, Xinyou completed its first funding round, securing investment to further its business aims.

The founder's background and previous ventures are not publicly detailed, and there is no information regarding any parent companies or subsidiaries. Xinyou Microelectronics Technology specializes in advanced packaging solutions, particularly in the area of Panel-Level Packaging (PLP). The company's core offerings integrate five critical technologies and encompass various customizable packaging services designed to meet the demands of industries such as consumer electronics, telecommunications, industrial control, and renewable energy. By utilizing a fully domestic supply chain and 100% localized manufacturing equipment, Xinyou provides solutions that significantly reduce production costs while enhancing performance.

Their large-scale advanced packaging capabilities, including a notable processing size of 520×420mm, improve production efficiency and are tailored for high-power applications, particularly in new energy and industrial control sectors. The company's client base includes manufacturers of smartphones, tablets, wearables, 5G base stations, network devices, automation equipment, and electric vehicles, serving both domestic and international markets. Xinyou Microelectronics Technology generates revenue through direct sales of its advanced packaging solutions to various sectors, primarily operating on a B2B model. The company engages in contractual agreements with its clients, often working closely to develop tailored packaging solutions that suit specific industry needs.

Transactions typically involve bulk orders, where clients can access customized packaging services based on their unique product specifications. While specific pricing structures for individual services are not disclosed, the company emphasizes providing competitive pricing through its innovative, cost-effective technologies. The combination of its advanced product offerings and localized production capabilities positions Xinyou as a strong player in the advanced packaging industry, catering to a diverse array of clients in multiple geographical markets. In February 2026, Xinyou Microelectronics raised an undisclosed amount of Series A+ funding from new investor Shenzhen Bencent Electronics Co.

, Ltd. This funding will be utilized to expand its R&D team, upgrade its packaging production lines, and accelerate the mass production of automotive-grade and AI chip-supporting modules. The company is also actively exploring entry into new markets, aiming to establish a presence in key regions by 2027, thereby broadening its customer base and enhancing its competitive edge.