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Xingsi Semiconductor

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Year established

2020

Location

Shanghai China

Primary Industry

Electronics

About

Established in 2020 and based in Shanghai, China, Xingsi Semiconductor operates as a 5G internet of things connection chip developer that focuses on 5G connectivity chip field. The company has R&D centers located in Shanghai, Nanjing, Shenzhen and Chengdu. In December 2020, it raised CNY 100 million in angel funding from GL Ventures. The company provides 5G connectivity processor chips, related peripheral chips and integrated application chips. Its solutions include personal module, industrial module, vehicle module and edge computing.
Current Investors
GL Ventures, CDH Investments, GP Capital

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Primary Industry
Electronics
Sub Industries
Integrated Circuits
Verticals
IoT (Internet of Things), Manufacturing
Company Stage
Series A
Total Amount Raised
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