Xi'an ESWIN Material Technology

Based in Xi'an, China and established in 2016, Xi'an ESWIN Material Technology operates as a silicon materials provider that focuses on the 12 inch silicon single crystal polished wafers and epitaxial wafers The company is responsible for the silicone materials business of the Eswin Group. Xi'an ESWIN Material Technology has set up a factory in Xi'an, which has a design capacity of 500,000 wafers/month. In December 2021, it. raised CNY 4 billion in series C funding co-led by China Internet Investment Fund and CITIC Goldstone Fund Management.

 In June 2025, Xi'an Yiswei Materials Technology raised CNY 4. 634 billion in an IPO, issuing 537. 8 million shares at CNY 8. 62 per share on the Shanghai Stock Exchange under the ticker symbol “688783”.

Xi'an ESWIN Material Technology mainly develops and manufactures 12-inch silicon single crystal polished wafers and epitaxial wafers for integrated circuits. The company's materials can be used in logic chips, flash memory chips, dynamic random memory chips, image sensors, and display driver chips of the fields of electronics and telecommunications, automotive manufacturing, artificial intelligence and consumer electronics. Revenue is primarily generated through the sale of 12-inch silicon wafers to domestic and international customers, including top-tier foundries and IDM manufacturers. Additional income comes from long-term supply agreements and strategic partnerships.