Wushi

Based in Jiangsu, China and founded in 2020, Wushi Microelectronics (Suzhou) Co. , Ltd. , trading as Wushi, focuses on the development of high-performance semiconductor manufacturing equipment. In September 2026, Wushi raised CNY 100 million in Series A funding led by Summitview Capital with participation from GL Ventures, Suzhou Angel Investment Guidance Fund, Shenzhen Capital Real Estate Fund, TTGG Ventures, Optics Valley Industrial Investment Fund Management, Suzhou Industrial Park Science and Technology Innovation Fund, and other investors.

Wushi specializes in the development and sales of innovative equipment for wafer-level temporary bonding and debonding, as well as permanent bonding solutions. Its core products include the Heracles-series high-pressure permanent bonding machine, the fully automated blue film protective cleaning machine (WCN1S080X), and the WDB-Apollo300 automated laser/mechanical debonding system. The revenue model of Wushi is centered around B2B transactions with semiconductor manufacturers. The company engages in direct sales of its equipment, including flagship products such as the Heracles-series and the WDB-Apollo300, which are essential for semiconductor fabrication.

Clients typically place orders based on production needs, often accompanied by service agreements for maintenance and technical support. Following the completion of the Series A funding, the company will expand production capacity for wafer bonding equipment used in advanced 2. 5D and 3D stacked packaging and intensify R&D efforts on specialized bonding equipment for small- and medium-sized compound semiconductors, particularly for optical chips.