TYSiC

Established in 2009 and based in Dongguan, China, Guangdong Tianyu Semiconductor Co. , Ltd. , doing business as TYSiC and formerly known as Dongguan Tianyu Semiconductor Technology Co. , Ltd.

, is a semiconductor technology company that focuses on the research and development of SiC epitaxial wafers. In 2010, the company cooperated with the Institute of Semiconductors of the Chinese Academy of Sciences and co-founded the silicon carbide institute. TYSiC later scaled its production to 4-inch, 6-inch, and 8-inch epitaxial wafers and grew into a major supplier for power semiconductor manufacturers and research institutions. In December 2025, the company completed an IPO on the Hong Kong Stock Exchange under the ticker "2658".

The company's main product SiC epitaxial materials such as SBD (JBS, MPS) (Schottky Barrier Diode, PN junction composite structure), SIT (Static Induction Transistor) and bipolar static induction transistor SiC power devices:PIN diode, GTO (Gate turn-off Thyristor), and Thyristor. The company not only provides container chips for overseas chip companies but also provides single-chip for universities, research institutes and laboratories. The company’s revenue is generated through the sale of SiC epitaxial wafers, as well as from related services for semiconductor clients. The company plans to expand production capacity of SiC epitaxial wafers, enhance R&D capabilities, pursue strategic investments and acquisitions, and expand global sales networks using proceeds from its IPO.