Thintronics Inc.

Based in the US, Thintronics Inc. specializes in advanced interconnect dielectric materials, focusing on innovative solutions for the semiconductor industry to enhance performance and signal integrity. Founded in 2019 in Berkeley, US, Thintronics Inc. develops advanced interconnect materials, primarily through the creation of its flagship product, Thintronics on Substrate (TOS).

The company has completed 2 deals, with its most recent funding round being a Series A that raised USD 15. 925 mn on August 13, 2024. Investors include M Ventures, Maverick Ventures Israel, and Merck KGaA, indicating strong support from established industry players. Thintronics is not known to have any subsidiaries or parent companies, and the company has not undergone any significant pivots since its inception.

Thintronics specializes in advanced interconnect dielectric materials, particularly its flagship product, Thintronics on Substrate (TOS), a high-performance substrate dielectric film manufactured in the USA. This product significantly enhances signal integrity, achieving 30-50% better insertion loss at speeds of 224G/448G PAM4. By integrating computational, molecular, electrical, and process engineering, Thintronics provides tailored solutions across the interconnect stack, including PCB, substrate, and interposer applications, primarily serving the semiconductor industry and high-tech companies across North America, Europe, and select markets in Asia. Thintronics operates on a business-to-business (B2B) model, directly engaging clients in the semiconductor and technology sectors.

Transactions are structured through partnerships and long-term agreements with manufacturers requiring advanced interconnect solutions. Revenue is primarily generated from sales of the Thintronics on Substrate (TOS) product, with pricing agreements reflecting the premium nature of these materials. Customized solutions are designed to meet specific client needs, ensuring performance standards and supply chain resilience are maintained, which positions the company to enhance revenue through growing partnerships in the semiconductor industry. In August 2024, Thintronics Inc.

raised USD 15. 925 mn in Series A funding, co-led by Maverick Ventures Israel and TransLink Capital, with participation from other investors like Merck KGaA and Toppan Global Venture Partners. The funds will support the development of infrastructure for 5G/6G technologies. The company is focusing on expanding its product offerings and establishing a presence in new markets, particularly targeting regions in Asia by the end of 2025.