Shenzhen Xinyuan New Material Co., Ltd.
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Shenzhen Xinyuan New Material Co., Ltd. - overview
Established
2022
Location
Shenzhen, Guangdong, China
Primary Industry
Materials
About
Based in Shenzhen, China and established in 2022, Shenzhen Xinyuan New Material Co. , Ltd. operates as a semiconductor packaging materials developer that provides power semiconductor packaging and advanced integrated circuit packaging solutions. The company has more than 20 employees.
The founder of the company, Bo Hu, graduated from Harbin Institute of Technology and has a doctoral degree. In July 2024, it closed a series B funding. In May 2025, Shenzhen Xinyuan New Material Co. , Ltd.
raised Series C funding from new investor Xiaomi Private Equity Fund Management. The company provides power semiconductor packaging and advanced integrated circuit packaging solutions. It established a materials R&D platform based on silver sintering technology. Products include sintered silver materials, semi-sintered conductive adhesives, instantaneous liquid phase diffusion soldering materials, and electromagnetic shielding materials.
Sintered silver materials include pastes, preformed films and electrode sheets. Its products can be used in new energy vehicles, RF communication, smart grid, IGBT, photovoltaic and optoelectronics. Shenzhen Xinyuan New Material Co. , Ltd.
generates revenue by providing semiconductor packaging materials to power semiconductor and integrated circuit manufacturers.
Current Investors
South China Venture Capital, Yuanhe Puhua Suzhou Management, Nuoyan Capital
Primary Industry
Materials
Sub Industries
Integrated Circuits, Semiconductors, Adhesives & Sealants, Materials
Website
www.xinyuanmat.cn
Verticals
Manufacturing
Company Stage
Series C
Total Amount Raised
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