OptiPack Innovations

Based in China, OptiPack Innovations, operates as a developer and producer of benzocyclobutene (BCB) photoresists and their derivative materials used in semiconductor packaging and microelectronics. Based in Beijing, China and founded in 2024, OptiPack Innovations develops and produces benzocyclobutene (BCB) photoresists and their derivative materials. In September 2026, OptiPack Innovations raised an undisclosed amount in Pre-series A funding from Wenrun Investment and Shenyang Shengke Private Equity Fund Management. The funding will support R&D, production line expansion, and application validation of BCB photoresists.

OptiPack Innovations specializes in the research, development, production, and sales of benzocyclobutene (BCB) photoresists and their derivative materials. Their offerings include high-performance, low-dielectric electronic packaging materials for applications in integrated circuits and information communications within the microelectronics industry. The BCB photoresist is essential for advanced electronic packaging, showcasing outstanding film-forming properties and thermal stability, and is aimed at sectors such as aerospace, automotive, and military defense. Revenue generation for OptiPack Innovations is primarily structured through B2B transactions, supplying BCB photoresist and related materials directly to manufacturers in the electronics sector.

Products are sold through contractual agreements with businesses involved in semiconductor packaging and integrated circuit production, focusing on bulk orders for industrial use and ensuring competitive pricing without compromising quality. The company plans to utilize the Pre-series A funding for R&D and iterative development, production line expansion, and downstream application validation of benzocyclobutene (BCB) photoresists and their derivative materials.