Microview Intelligent Packaging Technology (Shenzhen) Co., Ltd

Established in 2019 and based in Shenzhen, China, Microview Intelligent Packaging Technology (Shenzhen) Co. , Ltd operates as a chip packaging equipment developer that focuses on high-precision optoelectronics R&D. The team member has more than 20 years of experience in the high-precision chip packaging industry and the research team accounts for 60% of its total employees. The company's products are exported to Europe and America.

In October 2022, it promoted a 1. 5um high-speed and high-precision automatic solid crystal machine MV-15H. In March 2023, the company was recognized as a national high-tech enterprise. In August 2025, it closed a series B funding.

The company uses chip packaging processes, mechanical operation, and control platforms, and machine vision and algorithms technologies. Its products are divided into three series, which include general-purpose high-precision molding machine series, special-purpose high-precision molding machine series, and flip-chip machine series, such as high flexibility and high precision molding machine MV-15D, micro-assembly molding machine MV-MAR, and ultrasonic hot press reversing machine MV-15F-TS. Products can be applied in the fields of military, aerospace, and healthcare.  The company generates revenue primarily through the sale of high-precision die bonding machines and related advanced packaging equipment.

Additional revenue is derived from after-sales support, customization and international exports.  Following its series B funding, the company plans to expand R&D in next-generation advanced packaging technologies targeting “transmission, storage, and computing” applications for the AI era. It is also advancing product lines into sub-micron bonding precision and expanding internationally, with a localized delivery and support system in East Asia, Southeast Asia and the US.