Hefei Sensor Turnkey Service

Based in Hefei, China, and established in 2020, Hefei Xince Semiconductor Co. , Ltd. , trading as Hefei Sensor Turnkey Service is a semiconductor component testing, packaging, and customized test program company that covering 8 and 12 wafer testing, grinding, cutting, module and terminal IC testing. The company's the first phase plant covers an area of about 8,000 square meters, equipped with equipment such as prober, high-end semiconductor automatic test equipment, R&D new test system of wafer and IC that every month testing production can reached 20,000 pcs of 8 inch and 12 inch wafer, image sensor and RF module testing and packaging, testing and packaging of monitor camera module and RF module for smart home appliance.

In October 2024, Hefei Sensor Turnkey Service raised Series B funding from new investors Hefei Construction Investment Group and Hefei High-tech Venture Capital. The company provides chip probing, IC final test, and test program development. The chip probing supports testing on 8 inch and 12-inch wafers. The final test includes the following product types: memory, MEMS, MCU, RF, etc.

The test supports the temperature range of -55 °C to 150 °C. The test program development includes test plan evaluation and formulation, test fixture development, test program development, mass production import and maintenance, test efficiency improvement, etc. The company generates revenue primarily from semiconductor packaging services, wafer and IC testing services, and customized test program development for domestic and international semiconductor manufacturers.