Goermicro Asset Profile

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Year established

2017

Location

Qingdao Shandong China

Primary Industry

Semiconductors

About

Established in 2017 and based in and based in Qingdao, China, Goermicro, a subsidiary of GoerTek Group Co., Ltd., focusing on packaging testing technology and product development. In 2019, the company’s advanced packaging and testing platform was completed and put into use. The platform was jointly initiated by Qingdao Science and Technology Bureau, Laoshan District People’s Government, and GoerTek Group Co., Ltd., focusing on the development and industrialization of SiP technology, MEMS sensor technology and AIoT technology. The company's main business is to provide packaging and testing services, including hardware solution design, packaging assembly, test packaging, reliability verification and failure analysis, etc. The company's sealing and testing equipment features ultra-thin passive components and high precision surface mount capability with multiple heterogeneous chips, which can be applied to the packaging and testing of MEMS, ASIC, wireless communication and other chips.

Current Investors

China International Capital Corporation, China Merchants Capital, CoStone Capital

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Primary Industry

Semiconductors

Sub Industries

Semiconductor Equipment & Testing

Website

www.goermicro.com

Total Amount Raised

Subscriber access only

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