Capcon

Based in Beijing, China, and founded in 2014, Capcon is a semiconductor company that provides semiconductor equipment for the semiconductor assembly and packaging industry. It has multiple branches in Singapore, Taiwan, the Philippines, and Beijing. In 2015, the R&D centers and production bases were established in Singapore. In 2018, it became a supplier of TSMC and TIME.

And in 2021, it entered in China market. The firm was co-established by Feng Yu, Honggang Wang, and Hongbo Wang. Feng Yu, and Honggang Wang, the co-founders, both once worked in the R&D team of K&S, ESEC, and UIC, and Feng Yu focused on precision electromechanical systems, system integration, and optimization, while Honggang Wang focused on Electrical system hardware, servo drives, optoelectronics, and big data analysis. In August 2023, Capcon raised strategic investment funding led by new investor Wise Road Capital.

The company provides semiconductor assembly & packaging equipment, including flip-chip bonders, chip-on-wafer bonders, package-on-package bonders, stack die bonders, pannel-level die bonders, and multi-chip die bonders. And products businesses named AvantGo 2060W, AvantGo 2060M, AvantGo 2060P, and AvantGo 2060SD. That packaging equipment enables covering the semiconductor packaging processes, including FOWLP(Face Up/Down), POP, MCM, EMCP, Stack Die, SIP, 2. 5D/3D, FCCSP, and FCBGA.

Its clients include ASE, SPIL, TSMC, AMD, TFME, JCET, DeeTee, and others.