Techsense Asset Profile

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Year established

2013

Location

Shanghai China

Primary Industry

Semiconductors

About

Established in 2013 and based in Shanghai, China, Techsense operates as a semiconductor automation equipment manufacturer focusing on semiconductor packaging and testing equipment. The core research team has more than 70 employees. And it has more than 2,000 square meters of plant, which includes a precision processing department, equipment assembly and commissioning workshop, and clean workshop. Besides, it has many clients, such as Sandisk, NXP, Amkor, and AT&S. In April 2023, it received series C funding from IDG Capital, Shang Qi Capital, Hudson Capital, etc. Techsense's products include ball implanters, epoxy mounters, DAF mounters, ultra-thin chip stack mounters, flip solder hot press mounters, multi-functional IGBT mounters for micro-assembly applications, and packaging and testing equipment. The ball implanters are based on substrates, sockets, wafers, and flat panels. And the packaging and testing equipment includes automatic optical inspection (AOI) inspection, measurement systems, and laser application equipment. It adopts microsphere ball planting technology, microsphere ball filling technology, and micro pin planting technology. Its product applies in semiconductor wafer manufacturing, semiconductor packaging testing OLED display panel, factory automation and PCB, FPC, and substrate manufacturing.

Current Investors

IDG Capital, Orient Securities Capital, Step Fund

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Primary Industry

Semiconductors

Sub Industries

Integrated Circuits, Semiconductor Equipment & Testing

Website

www.techsense.cn

Verticals

Manufacturing

Company Stage

Series C

Total Amount Raised

Subscriber access only

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