Jinzuan Technology Asset Profile

= Subscriber Access Only

You are viewing a preview of this profile. Request a Preqin Pro demo for full access to all profiles and underlying data.

Year established

2020

Location

Suzhou Jiangsu China

Primary Industry

Semiconductors

About

Established in 2020 and based in Suzhou, China, Jinzuan Technology is a high-tech enterprise that provides chip heat dissipation packaging materials and device products. In October 2024, the company closed a series B funding from Kunshan Hi-Tech Venture Capital. The company's main products include power device packaging substrates such as aluminum oxide, aluminum nitride and diamond copper. It also provides process services such as grinding and polishing, powder coating, plasma hot pressing and prefabricated gold-tin solder. The company's products and services are used in semiconductor power module applications such as RF and optoelectronics. The company generates revenue by providing semiconductor packaging heat sink material products and providing related process technology services. The company will enhance sales scale and accelerate product development and production line construction.

Current Investors

Huilihua Capital Management, SND Ventures Group, Kunshan Hi-Tech Venture Capital

Request a demo to show more

Primary Industry

Semiconductors

Sub Industries

Semiconductors, Advanced Materials

Verticals

Manufacturing

Company Stage

Series B

Total Amount Raised

Subscriber access only

Time to go Pro

Get Preqin Pro for unrestricted access to 600,000+ detailed profiles on fund managers, investors, funds, companies, and other alternative asset players. Unlock exclusive data on future plans, company financials, fundraising history, track records, and more.